NXP Semiconductors' high-performance, low-power switch supports Thunderbolt technology interface

NXP Semiconductors announced that its next-generation high-performance switch CBTL05024 supports Thunderbolt technology developed by Intel Corporation (Intel). CBTL05024 has 10Gbps high performance and excellent signal integration. In addition, the power consumption performance of this product is significantly lower than the power consumption requirements of the newly established Thunderbolt bus. NXP has demonstrated this Thunderbolt-based solution at the Intel Developer Forum (IDF 2012) this year, and samples of CBTL05024 are currently available to some customers.

Thunderbolt â„¢ technology is composed of two 10.3 Gbps full-duplex data channels, which can support high-speed data transmission between personal computers and peripheral devices and display devices. This technology can also support the connection of the data interface (PCI Express) and the display interface (DisplayPort) through a single line.

NXP â€™s high-speed switches are currently used in Thunderbolt connectors and are also listed as recommended products in Intel reference designs. This product provides high performance, excellent signal integration and a very low bill of materials (BOM). The new generation CBTL05024 has a highly integrated 10 Gbps Thunderbolt signal without the need for other external PIN diodes; in addition, it also has advanced product features that can improve signal integrity and power efficiency, and can be integrated into a very small HVQFN package.

Grahame Cooney, general manager of NXP Semiconductors â€™high-speed interface, timer and graphics driver product lines, pointed out:" Thunderbolt technology is gradually growing in the industry. Portable computing devices such as Ultrabooks, laptops and tablets will play more features, such as For performance requirements of small connectors and wires, connect them to displays, speakers, storage devices and other devices. By achieving excellent signal integration, ultra-low power consumption, high efficiency packaging, and extremely low bill of materials, we will Continue to strive to achieve ultra-high-speed data transmission. "

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